Interaction of copper(I)-polypyrrole complexes prepared by depositing-dissolving copper onto and from polypyrroles

Author: Liu Y.C.   Hwang B.J.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.339, Iss.1, 1999-02, pp. : 233-239

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Abstract