A new, general model for mechanical stress evolution during electromigration

Author： Sarychev M.E.   Zhitnikov Y.V.   Borucki L.   Liu C.-L.   Makhviladze T.M.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.365, Iss.2, 2000-04, pp. : 211-218

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