Nanometric patterning with ultrathin twist bonded silicon wafers

Author： Fournel F.   Moriceau H.   Magnea N.   Eymery J.   Buttard D.   Rouviere J.L.   Rousseau K.   Aspar B.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.380, Iss.1, 2000-12, pp. : 10-14

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Twist-type silicon bicrystals and compliant substrates prepared from silicon-on-insulator wafers

By Chen Chih   Tu K. N.   Tung C. H.   Sheng T. T.   Ploessl A.   Scholz R.   Gosele U.  

Philosophical Magazine. A. Physics of Condensed Matter. Defects and Mechanical Properties, Vol. 80, Iss. 4, 2000-04 ,pp. : 881-891

Taylor & Francis Ltd

Access to resources Recommend Favorite

Selective deposition of TiSi 2 on ultra-thin silicon-on-insulator (SOI) wafers

By Maa J.-s.   Ulrich B.   Teng Hsu S.   Stecker G.  

Thin Solid Films, Vol. 332, Iss. 1, 1998-11 ,pp. : 412-417

Elsevier

Access to resources Recommend Favorite

Scratch Fracture of Polycrystalline Silicon Wafers

By  

JOURNAL OF THE AMERICAN CERAMIC SOCIETY, Vol. 98, Iss. 8, 2015-08 ,pp. : 2587-2594

John Wiley & Sons Inc

Access to resources Recommend Favorite

Molecular dynamics simulation of the nanometric cutting of silicon

By Komanduri R.   Chandrasekaran N.   Raff L. M.  

Philosophical Magazine B, Vol. 81, Iss. 12, 2001-12 ,pp. : 1989-2019

Taylor & Francis Ltd

Access to resources Recommend Favorite

A dissociated dislocation in an ultrathin silicon plate

By Youssef S.  

Philosophical Magazine, Vol. 86, Iss. 20, 2006-07 ,pp. : 3077-3088

Taylor & Francis Ltd

Access to resources Recommend Favorite