Oxidation of Ta diffusion barrier layer for Cu metallization in thermal annealing

Author: Yin K.-M.   Chang L.   Chen F.-R.   Kai J.-J.   Chiang C.-C.   Chuang G.   Ding P.   Chin B.   Zhang H.   Chen F.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.388, Iss.1, 2001-06, pp. : 27-33

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Abstract