Effects of corner position and operating condition on electromigration failure in angled bamboo lines without passivation layer

Author： Sasagawa K.   Hasegawa M.   Naito K.   Saka M.   Abe H.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.401, Iss.1, 2001-12, pp. : 255-266

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Electromigration failure mechanisms in bamboo-grained Al(Cu) interconnections

By Hu C.-K.  

Thin Solid Films, Vol. 260, Iss. 1, 1995-05 ,pp. : 124-134

Elsevier

Access to resources Recommend Favorite

Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection

By Huang J.S.   Deng X.J.   Yih P.H.   Shofner T.L.   Obeng Y.S.   Darling C.  

Thin Solid Films, Vol. 397, Iss. 1, 2001-10 ,pp. : 186-193

Elsevier

Access to resources Recommend Favorite

Improving electromigration reliability in Al-alloy lines

By Rajagopalan G.   Dreyer M.L.   Theodore N.D.   Cale T.S.  

Thin Solid Films, Vol. 270, Iss. 1, 1995-12 ,pp. : 439-444

Elsevier

Access to resources Recommend Favorite

Passivation of Interfaces in Thin Film Solar Cells: Understanding the Effects of a Nanostructured Rear Point Contact Layer

By  

ADVANCED MATERIALS INTERFACES (ELECTRONIC), Vol. 5, Iss. 2, 2018-01 ,pp. : n/a-n/a

John Wiley & Sons Inc

Access to resources Recommend Favorite

Photovoltaics: Passivation of Interfaces in Thin Film Solar Cells: Understanding the Effects of a Nanostructured Rear Point Contact Layer (Adv. Mater. Interfaces 2/2018)

By  

ADVANCED MATERIALS INTERFACES (ELECTRONIC), Vol. 5, Iss. 2, 2018-01 ,pp. : n/a-n/a

John Wiley & Sons Inc

Access to resources Recommend Favorite