Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection

Author： Huang J.S.   Deng X.J.   Yih P.H.   Shofner T.L.   Obeng Y.S.   Darling C.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.397, Iss.1, 2001-10, pp. : 186-193

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