Residual stress and thermal expansion behavior of TaO x N y films by the micro-cantilever method

Author: Jong C.-A.   Chin T.-S.   Fang W.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.401, Iss.1, 2001-12, pp. : 291-297

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Abstract