Improvement of Ta-based thin film barriers on copper by ion implantation of nitrogen and oxygen

Author: Wieser E.   Peikert M.   Wenzel C.   Schreiber J.   Bartha J.W.   Bendjus B.   Melov V.V.   Reuther H.   Mucklich A.   Adolphi B.   Fischer D.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.410, Iss.1, 2002-05, pp. : 121-128

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Abstract