Post-etch residue removal in BCB/Cu interconnection structure

Author： young-tack H.   Kim Y.i.   Lee M.-c.   sunhee P.   dongha S.   Park C.M.   Hong B.   Roh Y.   hae Jung S.   Song I.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.435, Iss.1, 2003-07, pp. : 238-241

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