Author: Frach P. Glosz D. Goedicke K. Fahland M. Gnehr W.-M.
Publisher: Elsevier
ISSN: 0040-6090
Source: Thin Solid Films, Vol.445, Iss.2, 2003-12, pp. : 251-258
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
High rate deposition of TiO 2 by DC sputtering of the TiO 2-X target
By Ohsaki H. Tachibana Y. Mitsui A. Kamiyama T. Hayashi Y.
Thin Solid Films, Vol. 392, Iss. 2, 2001-07 ,pp. :
TiO 2-X sputter for high rate deposition of TiO 2
By Tachibana Y. Ohsaki H. Hayashi A. Mitsui A. Hayashi Y.
Vacuum, Vol. 59, Iss. 2, 2000-11 ,pp. :
High rate sputter deposition of TiO 2 from TiO 2-x target
By Ohsaki H. Tachibana Y. Hayashi A. Mitsui A. Hayashi Y.
Thin Solid Films, Vol. 351, Iss. 1, 1999-08 ,pp. :