Reaction mechanism of trilevel resist etching in O 2 /SO 2 plasma: controlling factors for sidewall passivation

Author: Ha J.H.   Yi D.H.   Kim J.J.  

Publisher: Elsevier

ISSN: 0042-207X

Source: Vacuum, Vol.51, Iss.4, 1998-12, pp. : 519-524

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Abstract