The effect of adhesion promoter layer thickness on the adhesion strength between silicone rubber and aluminium

By BÁNHEGYI GYÖRGY  

Composite Interfaces, Vol. 5, Iss. 1, 1997-01 ,pp. : 31-40

Taylor & Francis Ltd

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Enhanced stability of platinized silicon substrates using an unconventional adhesion layer deposited by CSD for high temperature dielectric thin film deposition

By Halder S.   Schneller T.   Waser R.  

Applied Physics A, Vol. 87, Iss. 4, 2007-06 ,pp. : 705-708

Springer Publishing Company

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Electrical property on copper thin film with chromium under-layer

By Nakai H.   Fudaba K.   Shinzawa K.   Hashimoto M.  

Thin Solid Films, Vol. 317, Iss. 1, 1998-04 ,pp. : 202-205

Elsevier

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Relationship between fibre-matrix adhesion and the interfacial shear strength in polymer-based composites

By Nardin M.   Schultz J.  

Composite Interfaces, Vol. 1, Iss. 2, 1993-01 ,pp. : 177-192

Taylor & Francis Ltd

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Effects of hygrothermal ageing and thermal shock on reliability of interfacial adhesion between black oxide coated copper substrate and epoxy resin

By Kim Jang-Kyo   Lebbai Mohamed   Woo Ricky S.C.  

Composite Interfaces, Vol. 12, Iss. 8-9, 2005-10 ,pp. : 739-756

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