Enhanced stability of platinized silicon substrates using an unconventional adhesion layer deposited by CSD for high temperature dielectric thin film deposition

Author: Halder S.   Schneller T.   Waser R.  

Publisher: Springer Publishing Company

ISSN: 0947-8396

Source: Applied Physics A, Vol.87, Iss.4, 2007-06, pp. : 705-708

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next