Author: Knizikevicius R.
Publisher: Elsevier
ISSN: 0042-207X
Source: Vacuum, Vol.65, Iss.1, 2002-02, pp. : 101-108
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Real dimensional simulation of anisotropic etching of silicon in CF 4 +O 2 plasma
By Knizikevicius R. Galdikas A. Grigonis A.
Vacuum, Vol. 66, Iss. 1, 2002-06 ,pp. :
SiO 2 Etching using high density plasma sources
By Tsukada T. Nogami H. Nakagawa Y. Wani E. Mashimo K. Sato H. Samukawa S.
Thin Solid Films, Vol. 341, Iss. 1, 1999-03 ,pp. :
Inductively coupled plasma etching of SiO 2 layers for planar lightwave circuits
By Jung S.-T. Song H.-S. Kim D.-S. Kim H.-S.
Thin Solid Films, Vol. 341, Iss. 1, 1999-03 ,pp. :