LACBED study of a 3 grain boundary in a Cu +6 at% Si alloy

Author： Kim H.S.   Goodman P.   Schwartzman A.   Tulloch P.   Forwood C.T.  

Publisher： Elsevier

ISSN： 0304-3991

Source： Ultramicroscopy, Vol.77, Iss.1, 1999-05, pp. : 83-95

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