Modeling of large area hot embossing

Author: Worgull M.  

Publisher: Springer Publishing Company

ISSN: 0946-7076

Source: Microsystem Technologies, Vol.14, Iss.7, 2008-07, pp. : 1061-1066

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract