Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder

By Çadırlı E.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 31-40

Springer Publishing Company

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Some mechanical properties of Sn–3.5 Ag eutectic alloy at different temperatures

By El-Bahay M. M.   El Mossalamy M. E.   Mahdy M.   Bahgat A. A.  

Journal of Materials Science: Materials in Electronics, Vol. 15, Iss. 8, 2004-08 ,pp. : 519-526

Springer Publishing Company

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Dependence of frequency on Young's modulus and internal friction in Sn–9Zn and Sn–3.5Ag eutectic lead-free solders

By Ohoka T.   Nakamura Y.   Ono T.  

Journal of Materials Science, Vol. 39, Iss. 13, 2004-07 ,pp. : 4379-4381

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Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

By Nakamura Y.   Ono T.  

Journal of Materials Science, Vol. 40, Iss. 12, 2005-06 ,pp. : 3267-3269

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Effect of growth rate and lamellar spacing on microhardness in the directionally solidified Pb-Cd, Sn-Zn and Bi-Cd eutectic alloys

By Kaya H.   Gündüz M.   Çadirli E.   Uzun O.  

Journal of Materials Science, Vol. 39, Iss. 21, 2004-11 ,pp. : 6571-6576

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