Temperature dependence of anelastic properties in Sn–Ag–Cu system and Sn-3.5Ag alloys of lead-free solders

Author: Nakamura Y.   Ono T.  

Publisher: Springer Publishing Company

ISSN: 0022-2461

Source: Journal of Materials Science, Vol.40, Iss.12, 2005-06, pp. : 3267-3269

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Abstract