

Author: Ji Feifei
Publisher: Springer Publishing Company
ISSN: 0957-4522
Source: Journal of Materials Science: Materials in Electronics, Vol.23, Iss.1, 2012-01, pp. : 164-168
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content


By Shi Feng
Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 9, 2011-09 ,pp. :




By Shi Feng
Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 6, 2011-06 ,pp. :


By Kim Deok-Kyu Park Choon-Bae
Journal of Materials Science: Materials in Electronics, Vol. 25, Iss. 4, 2014-04 ,pp. :