Journal of Materials Science: Materials in Electronics,volume 23,issue 1  (01-2014)

Period of time： 2014年1期

Publisher： Springer Publishing Company

Founded in： 1990

Total resources： 58

ISSN： 0957-4522

Subject： TB General Industrial Technology

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Journal of Materials Science: Materials in Electronics,volume 23,issue 1

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Featured issue: Lead-free solder and packaging

By Willoughby Arthur in (2012)

Journal of Materials Science: Materials in Electronics,volume 23,issue 1 , Vol. 23, Iss. 1, 2012-01 , pp. 1-1

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Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression

By Zou Changdong in (2012)

Journal of Materials Science: Materials in Electronics,volume 23,issue 1 , Vol. 23, Iss. 1, 2012-01 , pp. 2-7

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Interface fracture surface energy of sol-gel bonded silicon wafers by three-point bending

By Latella B. in (2012)

Journal of Materials Science: Materials in Electronics,volume 23,issue 1 , Vol. 23, Iss. 1, 2012-01 , pp. 8-13

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Effects of trace amounts of rare earth additions on the microstructures and interfacial reactions of Sn57Bi1Ag/Cu solder joints

By Wu Cuiping in (2012)

Journal of Materials Science: Materials in Electronics,volume 23,issue 1 , Vol. 23, Iss. 1, 2012-01 , pp. 14-21

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Preparation of highly conductive adhesives by in situ generated and sintered silver nanoparticles during curing process

By Gao Hong in (2012)

Journal of Materials Science: Materials in Electronics,volume 23,issue 1 , Vol. 23, Iss. 1, 2012-01 , pp. 22-30

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Influence of temperature gradient and growth rate on the mechanical properties of directionally solidified Sn-3.5 wt% Ag eutectic solder

By Çadırlı E. in (2012)

Journal of Materials Science: Materials in Electronics,volume 23,issue 1 , Vol. 23, Iss. 1, 2012-01 , pp. 31-40

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Thermo-compression bonding of electrodes between FPCB and RPCB by using Pb-free solders

By Yoon Jeong-Won in (2012)

Journal of Materials Science: Materials in Electronics,volume 23,issue 1 , Vol. 23, Iss. 1, 2012-01 , pp. 41-47

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Impact of interfacial solubility on penetration of metals into dielectrics and the mechanism of failure

By Plawsky Joel. in (2012)

Journal of Materials Science: Materials in Electronics,volume 23,issue 1 , Vol. 23, Iss. 1, 2012-01 , pp. 48-55

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Suppression of Cu 3 Sn and Kirkendall voids at Cu/Sn-3.5Ag solder joints by adding a small amount of Ge

By Yu Chun in (2012)

Journal of Materials Science: Materials in Electronics,volume 23,issue 1 , Vol. 23, Iss. 1, 2012-01 , pp. 56-60

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Liquid-solid interfacial reactions of Sn-Ag and Sn-Ag-In solders with Cu under bump metallization

By Wang Dong-Liang in (2012)

Journal of Materials Science: Materials in Electronics,volume 23,issue 1 , Vol. 23, Iss. 1, 2012-01 , pp. 61-67

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