Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS

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Microelectronics International, Vol. 30, Iss. 1, 2013-01 ,pp. : 14-18

Emerald Group Publishing Ltd

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An investigation of the impact of a Ti barrier metal on the thermal stress field in passivated aluminium lines and vias in VLSI systems using finite element modelling approach

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International Journal of Electronics, Vol. 87, Iss. 11, 2000-11 ,pp. : 1289-1299

Taylor & Francis Ltd

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Discrete Finite-Element Simulation of Thermoelectric Phenomena in Spark Plasma Sintering

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Journal of Electronic Materials, Vol. 40, Iss. 5, 2011-05 ,pp. : 873-878

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Finite element analysis on factors influencing the clamping force in an electrostatic chuck

By Xingkuo Wang   Jia Cheng   Kesheng Wang   Yiyong Yang   Yuchun Sun   Minglu Cao   Linhong Ji  

Journal of Semiconductors, Vol. 35, Iss. 9, 2014-09 ,pp. : 94011-94015

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Complete Analysis of the Characteristics of Propagation into Photonic Crystal Fibers, by the Finite Element Method

By Brechet F.   Marcou J.   Pagnoux D.   Roy P.  

Optical Fiber Technology, Vol. 6, Iss. 2, 2000-04 ,pp. : 181-191

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