Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C

By Wang Kai-Jheng  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2558-2563

Springer Publishing Company

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Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

By Li G.  

Journal of Electronic Materials, Vol. 40, Iss. 2, 2011-02 ,pp. : 165-175

Springer Publishing Company

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Dependence of Sn Grain Morphology of Sn-Ag-Cu Solder on Solidification Temperature

By Arfaei B.  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 362-374

Springer Publishing Company

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Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1967-1976

Springer Publishing Company

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Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation

By Lee Tae-Kyu  

Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 273-282

Springer Publishing Company

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