Author: DeLucca John
Publisher: Springer Publishing Company
ISSN: 1543-186X
Source: Journal of Electronic Materials, Vol.41, Iss.4, 2012-04, pp. : 748-756
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Surface treatment of wire bonding metal pads
By Alberici S. Coulon D. Joubin P. Mignot Y. Oggioni L. Petruzza P. Piumi D. Zanotti L.
Microelectronic Engineering, Vol. 70, Iss. 2, 2003-11 ,pp. :
Improving the deflection of wire bonds in stacked chip scale package (CSP)
By Yao Y.F. Lin T.Y. Chua K.H.
Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. :
By Xu Hui Liu Changqing Silberschmidt Vadim V. Chen Zhong Wei Jun
Microelectronics International, Vol. 27, Iss. 1, 2010-01 ,pp. :