Effect of Pd Thickness on the Interfacial Reaction and Shear Strength in Solder Joints Between Sn-3.0Ag-0.5Cu Solder and Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Surface Finish

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Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 763-773

Springer Publishing Company

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Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging

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Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing

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Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints

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Journal of Electronic Materials, Vol. 41, Iss. 11, 2012-11 ,pp. : 3169-3178

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Electromigration in Cu-Cored Sn-3.5Ag-0.7Cu Solder Interconnects Under Current Stressing

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Journal of Electronic Materials, Vol. 43, Iss. 4, 2014-04 ,pp. : 1144-1149

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