Kinetics and mechanism of gold dissolution in thiourea solutions: Effect of sulfide ions

By Bek R.   Shuraeva L.  

Russian Journal of Electrochemistry, Vol. 42, Iss. 4, 2006-04 ,pp. : 293-298

MAIK Nauka/Interperiodica

Access to resources Recommend Favorite

The effect of thiourea, l(−) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition

By Tadesse Bogale   Horne Michael   Addai-Mensah Jonas  

Journal of Applied Electrochemistry, Vol. 43, Iss. 12, 2013-12 ,pp. : 1185-1195

Springer Publishing Company

Access to resources Recommend Favorite

Catalytic effect of Pd nanoparticles on electroless copper deposition

By Lee Chien-Liang   Huang Yu-Ching   Kuo Li-Chen  

Journal of Solid State Electrochemistry, Vol. 11, Iss. 5, 2007-05 ,pp. : 639-646

Springer Publishing Company

Access to resources Recommend Favorite

Inhibition effect of some surface active agents on dissolution of copper in nitric acid

By Maayta A.K.   Bitar M.B.   Al-Abdallah M.M.  

British Corrosion Journal, Vol. 36, Iss. 2, 2001-02 ,pp. : 133-135

Maney Publishing

Access to resources Recommend Favorite

An electrochemical study of the dissolution of gold in thiosulfate solutions. Part II. Effect of Copper

By Zhang Suchun   Nicol M.  

Journal of Applied Electrochemistry, Vol. 35, Iss. 3, 2005-03 ,pp. : 339-345

Springer Publishing Company

Access to resources Recommend Favorite