Effect of polyoxyethylenelaurylether on electrodeposition of Pb-free Sn-Bi alloy

Author： Fukuda M. Imayoshi K. Matsumoto Y.

Publisher： Elsevier

ISSN： 0013-4686

Source： Electrochimica Acta, Vol.47, Iss.3, 2001-10, pp. : 459-464

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Creep Behavior of a Sn-Ag-Bi Pb-Free Solder

By Vianco Paul Rejent Jerome Grazier Mark Kilgo Alice

Materials, Vol. 5, Iss. 11, 2012-11 ,pp. : 2151-2175

MDPI

Access to resources Recommend Favorite

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

By Jamadon Nashrah Hani Tan Ai Wen Yusof Farazila Ariga Tadashi Miyashita Yukio Hamdi Mohd

Metals, Vol. 6, Iss. 9, 2016-09 ,pp. : 220-220

MDPI

Access to resources Recommend Favorite

Electrodeposition of copper and nickel on InBi alloy electrodes

By Azzag M. Chatelut M. Vittori O.

Journal of Applied Electrochemistry, Vol. 27, Iss. 6, 1997-06 ,pp. : 699-705

Springer Publishing Company

Access to resources Recommend Favorite

Electrodeposition of PbO2 and Bi–PbO2 on Ebonex

By Ras A.H. Staden J.F.v.

Journal of Applied Electrochemistry, Vol. 29, Iss. 3, 1999-03 ,pp. : 313-319

Springer Publishing Company

Access to resources Recommend Favorite

Effect of aromatic aldehydes on the electrodeposition of ZnCo alloy from cyanide-free alkaline-gluconate electrolytes

By Ortiz-Aparicio José

Journal of Applied Electrochemistry, Vol. 41, Iss. 6, 2011-06 ,pp. : 669-679

Springer Publishing Company

Access to resources Recommend Favorite