Evaluation of interfacial fracture toughness of a flip-chip package and a bimaterial system by a combined experimental and numerical method

Author： Wang J. Zou D. Lu M. Ren W. Liu S.

Publisher： Elsevier

ISSN： 0013-7944

Source： Engineering Fracture Mechanics, Vol.64, Iss.6, 1999-12, pp. : 781-797

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