The Effect of the physico-chemical properties of cellulosic polymers on the Si wafer polishing process

Author: Kim Sang-Kyun   Kim Ye-Hwan   Paik Ungyu   Katoh Takeo   Park Jea-Gun  

Publisher: Springer Publishing Company

ISSN: 1385-3449

Source: Journal of Electroceramics, Vol.17, Iss.2-4, 2006-12, pp. : 835-839

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Abstract