Effect of Isothermal Aging and Thermal Cycling on Interfacial IMC Growth and Fracture Behavior of SnAgCu/Cu Joints

By Li Xiaoyan  

Journal of Electronic Materials, Vol. 40, Iss. 1, 2011-01 ,pp. : 51-61

Springer Publishing Company

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Interfacial Effects During Thermal Cycling of Cu-Filled Through-Silicon Vias (TSV)

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Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. : 322-335

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Electromigration-Induced Interfacial Reactions in Cu/Sn/Electroless Ni-P Solder Interconnects

By Huang M.  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 730-740

Springer Publishing Company

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Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n , and Implications for EM Reliability Assessment

By Budiman A.S.  

Journal of Electronic Materials, Vol. 39, Iss. 11, 2010-11 ,pp. : 2483-2488

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Thermal Management and Interfacial Properties in High-Power GaN-Based Light-Emitting Diodes Employing Diamond-Added Sn-3 wt.%Ag-0.5 wt.%Cu Solder as a Die-Attach Material

By Chen Chia-Ju  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2618-2626

Springer Publishing Company

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