Electromigration-Induced Plastic Deformation in Cu Interconnects: Effects on Current Density Exponent, n , and Implications for EM Reliability Assessment

Author： Budiman A.S.  

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.39, Iss.11, 2010-11, pp. : 2483-2488

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