Tensile, creep, and ABI tests on sn5%sb solder for mechanical property evaluation

Author： Murty K.   Haggag Fahmy   Mahidhara Rao  

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.26, Iss.7, 1997-07, pp. : 839-846

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