Effects of post-annealing by the rapid thermal process on the characteristics of MOCVD-Cu/TiN/Si structures

Author: Kim Youn   Jun Chi-Hoon   Kim Dae  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.28, Iss.4, 1999-04, pp. : 369-371

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