An Optimum Approach for Fabrication of Tapered Hemispherical-End Fiber for Laser Module Packaging

Author: Yang H.M.   Jou D.C.   Chen M.H.   Wu S.H.   Cheng W.H.  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.30, Iss.3, 2001-03, pp. : 271-274

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Abstract