Chemical and Morphological Studies of Plasma-Treated Integrated Circuit Bond Pads

Author： Chong Y.F.   Gopalakrishnan R.   Tsang C.F.   Sarkar G.   Lim S.   Tatti S.  

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.30, Iss.3, 2001-03, pp. : 275-282

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