Carbon Nanotube Thermal Pastes for Improving Thermal Contacts

Author: Xu Yunsheng   Leong Chia-Ken   Chung D.D.L.  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.36, Iss.9, 2007-09, pp. : 1181-1187

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Abstract

The use of 0.6 vol.% single-walled carbon nanotubes in a poly(ethylene glycol)-based dispersion gave a thermal paste that was as effective as solder for improving thermal contacts. A thermal contact conductance of 20 × 104 W m−2 K−1 was attained. An excessive amount of nanotubes (e.g. 1.8 vol.%) degraded the performance, because of conformability loss. The nanotubes were more effective than hexagonal boron nitride particles but were less effective than carbon black, which gave a thermal contact conductance of 30 × 104 W m−2 K−1.