![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Author: Liu Jianguo
Publisher: Springer Publishing Company
ISSN: 1543-186X
Source: Journal of Electronic Materials, Vol.39, Iss.10, 2010-10, pp. : 2267-2273
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Atkinson J.K. Glanc M. Boltryk P. Sophocleous M. Garcia-Breijo E.
Microelectronics International, Vol. 28, Iss. 2, 2011-05 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
Microwave heating of electrically conductive materials
Radiophysics and Quantum Electronics, Vol. 48, Iss. 10-11, 2005-10 ,pp. :
![](/images/ico/ico_close.png)
![](/images/ico/ico5.png)
By Zheng Yulan Atkinson John Zhang Zhige Sion Russ
Microelectronics International, Vol. 19, Iss. 1, 2002-04 ,pp. :