Effects of Surface Finishes and Current Stressing on Interfacial Reaction Characteristics of Sn-3.0Ag-0.5Cu Solder Bumps

By Kim Jae-Myeong  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 791-799

Springer Publishing Company

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Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints

By Zhou M.  

Journal of Electronic Materials, Vol. 41, Iss. 11, 2012-11 ,pp. : 3169-3178

Springer Publishing Company

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Impact Testing of Sn-3.0Ag-0.5Cu Solder with Ti/Ni(V)/Cu Under Bump Metallization After Aging at 150°C

By Wang Kai-Jheng  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2558-2563

Springer Publishing Company

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Effects of Minor Ni Doping on Microstructural Variations and Interfacial Reactions in Cu/Sn-3.0Ag-0.5Cu- x Ni/Au/Ni Sandwich Structures

By Yu Chi-Yang  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2544-2552

Springer Publishing Company

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Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

By Kim Young  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2504-2512

Springer Publishing Company

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