Undercooling Behavior and Intermetallic Compound Coalescence in Microscale Sn-3.0Ag-0.5Cu Solder Balls and Sn-3.0Ag-0.5Cu/Cu Joints

By Zhou M.  

Journal of Electronic Materials, Vol. 41, Iss. 11, 2012-11 ,pp. : 3169-3178

Springer Publishing Company

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Comparative study of the dissolution kinetics of electrolytic Ni and electroless Ni-P by the molten Sn3.5Ag0.5Cu solder alloy

By Islam M.N.   Chan Y.C.   Sharif A.   Alam M.O.  

Microelectronics Reliability, Vol. 43, Iss. 12, 2003-12 ,pp. : 2031-2037

Elsevier

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Interfacial Reactions of Sn-3.0Ag-0.5Cu Solder with Cu-Mn UBM During Aging

By Tseng Chien-Fu  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2522-2527

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Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys

By Tucker J.  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 800-800

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Viscoplastic Creep Response and Microstructure of As-Fabricated Microscale Sn-3.0Ag-0.5Cu Solder Interconnects

By Cuddalorepatta Gayatri  

Journal of Electronic Materials, Vol. 39, Iss. 10, 2010-10 ,pp. : 2292-2309

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