Formation and Growth of Intermetallic Compound Cu 6 Sn 5 at Early Stages in Lead-Free Soldering

Author: Park M.S.  

Publisher: Springer Publishing Company

ISSN: 1543-186X

Source: Journal of Electronic Materials, Vol.39, Iss.12, 2010-12, pp. : 2574-2582

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract