Stress Relaxation Mechanisms of Sn and SnPb Coatings Electrodeposited on Cu: Avoidance of Whiskering

Author： Sobiech M.  

Publisher： Springer Publishing Company

ISSN： 1543-186X

Source： Journal of Electronic Materials, Vol.40, Iss.11, 2011-11, pp. : 2300-2313

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Reliability assessment for SnPb solder and Ag-Pd bond pad metallization

By Teo Kiat Choon   Ting Yu Lin  

Microelectronics International, Vol. 22, Iss. 2, 2005-08 ,pp. : 21-27

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Erratum to: Constitutive Behavior of Mixed Sn-Pb/Sn-3.0Ag-0.5Cu Solder Alloys

By Tucker J.  

Journal of Electronic Materials, Vol. 41, Iss. 4, 2012-04 ,pp. : 800-800

Springer Publishing Company

Access to resources Recommend Favorite

Creep, stress relaxation, and plastic deformation in Sn-Ag and Sn-Zn eutectic solders

By Mavoori H.   Chin J.   Vaynman S.   Moran B.   Keer L.   Fine M.  

Journal of Electronic Materials, Vol. 26, Iss. 7, 1997-07 ,pp. : 783-790

Springer Publishing Company

Access to resources Recommend Favorite

Compression Stress–Strain Behavior of Sn-Ag-Cu Solders

By Lopez Edwin  

Journal of Electronic Materials, Vol. 39, Iss. 1, 2010-01 ,pp. : 97-104

Springer Publishing Company

Access to resources Recommend Favorite

Interaction Between Ni and Cu Across 95Pb-5Sn High-Lead Layer

By Chang C.C.  

Journal of Electronic Materials, Vol. 39, Iss. 12, 2010-12 ,pp. : 2662-2668

Springer Publishing Company

Access to resources Recommend Favorite