Influence of Dopant on Growth of Intermetallic Layers in Sn-Ag-Cu Solder Joints

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Journal of Electronic Materials, Vol. 40, Iss. 2, 2011-02 ,pp. : 165-175

Springer Publishing Company

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Martensitic Transformation in Sn-Rich SnIn Solder Joints

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Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects

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Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1895-1902

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Kinetics of Intermetallic Compound Formation at the Interface Between Sn-3.0Ag-0.5Cu Solder and Cu-Zn Alloy Substrates

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Electromigration in a Sn-3 wt.%Ag-0.5 wt.%Cu-3 wt.%Bi Solder Stripe Between Two Cu Electrodes Under Current Stressing

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Journal of Electronic Materials, Vol. 40, Iss. 9, 2011-09 ,pp. : 1943-1949

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