Author: He Xiaofei
Publisher: Springer Publishing Company
ISSN: 1543-186X
Source: Journal of Electronic Materials, Vol.40, Iss.9, 2011-09, pp. : 1921-1936
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Creep Behavior of Bi-Containing Lead-Free Solder Alloys
By Witkin David
Journal of Electronic Materials, Vol. 41, Iss. 2, 2012-02 ,pp. :