Period of time: 2015年1期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 15,issue 1
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Reducing bonding cycle time of adhesive flip chip process
By Seppälä Anne,Aalto Kati,Ristolainen Eero in (2003)
Soldering & Surface Mount Technology,volume 15,issue 1 , Vol. 15, Iss. 1, 2003-02 , pp.Finite element analysis of a three-dimensional package
By Zhong Zhaowei,Yip Peng Kiong in (2003)
Soldering & Surface Mount Technology,volume 15,issue 1 , Vol. 15, Iss. 1, 2003-02 , pp.The analysis of creep data for solder alloys
Soldering & Surface Mount Technology,volume 15,issue 1 , Vol. 15, Iss. 1, 2003-02 , pp.The influence of multiple reflow cycles on solder joint voids for lead-free PBGAs
By Nurmi S.T.,Sundelin J.J.,Ristolainen E.O.,Lepistö T in (2003)
Soldering & Surface Mount Technology,volume 15,issue 1 , Vol. 15, Iss. 1, 2003-02 , pp.Creep behaviour of composite lead-free electronic solder joints
By Guo F,Lee J,Subramanian K.N. in (2003)
Soldering & Surface Mount Technology,volume 15,issue 1 , Vol. 15, Iss. 1, 2003-02 , pp.Fine pitch stencil printing using enclosed printing systems
By Zou Ling Chunxian,Dusek Milos,Wickham Martin,Hunt Christopher in (2003)
Soldering & Surface Mount Technology,volume 15,issue 1 , Vol. 15, Iss. 1, 2003-02 , pp.Advanced alloy for lead-free solder balls
By Dittes Marc,Walter Hermann in (2003)
Soldering & Surface Mount Technology,volume 15,issue 1 , Vol. 15, Iss. 1, 2003-02 , pp.