Publisher： Emerald Group Publishing Ltd
Founded in： 1981
Total resources： 58
E-ISSN： 1758-6836
ISSN： 0954-0911
Subject： TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology
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Bonding of zero-shrink LTCC with alumina ceramics
By SomerJakubDepartment of Microelectronics, Brno University of Technology, FEEC, Brno, Czech Republic, ŠtekovičMichalDepartment of Microelectronics, Brno University of Technology, FEEC, Brno, Czech Republic, UrbanFrantišekDepartment of Microelectronics, Brno University of Technology, FEEC, Brno, Czech Republic, ŠanderaJosefDepartment of Microelectronics, Brno University of Technology, FEEC, Brno, Czech Republic, SzendiuchIvanDepartment of Microelectronics, Brno University of Technology, FEEC, Brno, Czech Republic in (2015)
Soldering & Surface Mount Technology , Vol. 27, Iss. 4, 2015-09 , pp.
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Realistic warpage evaluation of printed board assembly during reflow process
By ChungSoonwanGlobal Technology Center, Samsung Electronics Co., Ltd., Suwon-si, Republic of Korea, KwakJae B.Global Technology Center, Samsung Electronics Co., Ltd., Suwon-si, Republic of Korea in (2015)
Soldering & Surface Mount Technology , Vol. 27, Iss. 4, 2015-09 , pp.Relative effect of solder flux chemistry on the humidity related failures in electronics
By VerdingovasVadimasMaterials and Surface Engineering, Department of Mechanical Engineering, Technical University of Denmark, DK 2800 Kgs. Lyngby, Denmark, JellesenMorten StendahlMaterials and Surface Engineering, Department of Mechanical Engineering, Technical University of Denmark, DK 2800 Kgs. Lyngby, Denmark, AmbatRajanMaterials and Surface Engineering, Department of Mechanical Engineering, Technical University of Denmark, DK 2800 Kgs. Lyngby, Denmark in (2015)
Soldering & Surface Mount Technology , Vol. 27, Iss. 4, 2015-09 , pp.By Ye Tian The School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou, China AND The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USAThe School of Mechanical and Electrical Engineering, Henan University of Technology, Zhengzhou, China AND The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA, ChowJustinThe George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA, LiuXiThe George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA, SitaramanSuresh K.The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, USA in (2015)
Soldering & Surface Mount Technology , Vol. 27, Iss. 4, 2015-09 , pp.By GaoLilanTianjin Key Laboratory of the Design and Intelligent Control of the Advanced Mechatronical System, Tianjin University of Technology, Tianjin, PR China, GaoHongSchool of Chemical Engineering and Technology, Tianjin University, Tianjin, PR China, ChenXuSchool of Chemical Engineering and Technology, Tianjin University, Tianjin, PR China in (2015)
Soldering & Surface Mount Technology , Vol. 27, Iss. 4, 2015-09 , pp.By PengHui YuenSchool of Physics, Universiti Sains Malaysia, Penang, Malaysia, DevarajanMutharasuSchool of Physics, Universiti Sains Malaysia, Penang, Malaysia, LeeTeik ToonSolid State Lighting Department, OSRAM Opto Semiconductor Sdn. Bhd., Penang, Malaysia, LaceyDavidResearch and Innovation Department, OSRAM Opto Semiconductor Sdn. Bhd., Penang, Malaysia in (2015)
Soldering & Surface Mount Technology , Vol. 27, Iss. 4, 2015-09 , pp.Thermal cycling aging effects on the ratcheting behavior of anisotropic conductive film
By GaoHongSchool of Chemical Engineering and Technology, Tianjin University, Tianjin, PR China, JianhuaSchool of Chemical Engineering and Technology, Tianjin University, Tianjin, PR China, GaoLilanTianjin Key Laboratory of the Design and Intelligent Control of the Advanced Mechatronical System, Tianjin University of Technology, Tianjin, PR China, YuDunjiSchool of Chemical Engineering and Technology, Tianjin University, Tianjin, PR China, SunJinshengSchool of Chemical Engineering and Technology, Tianjin University, Tianjin, PR China in (2015)
Soldering & Surface Mount Technology , Vol. 27, Iss. 4, 2015-09 , pp.By Haseeb A. S. M. A.,Beake B.,Haseeb A. S. M. A. in (2015)
Soldering & Surface Mount Technology , Vol. 27, Iss. 2, 2015-04 , pp.Soldering & Surface Mount Technology , Vol. 27, Iss. 2, 2015-04 , pp.
Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling
By Yin Yanfang,Ye Jianping,Wu Yiping in (2015)
Soldering & Surface Mount Technology , Vol. 27, Iss. 2, 2015-04 , pp.
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