Period of time: 2014年2期
Publisher: Emerald Group Publishing Ltd
Founded in: 1981
Total resources: 58
ISSN: 0954-0911
Subject: TF Metallurgical Industry
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Soldering & Surface Mount Technology,volume 26,issue 2
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Temperature cycling with Peltier elements of boards with SMD components and failure evaluation
By Šandera Josef,Nicák Michal in (2014)
Soldering & Surface Mount Technology,volume 26,issue 2 , Vol. 26, Iss. 2, 2014-04 , pp.Reliability analysis of an ACA attached flex-on-board assembly for industrial application
By Kiilunen Janne,Frisk Laura in (2014)
Soldering & Surface Mount Technology,volume 26,issue 2 , Vol. 26, Iss. 2, 2014-04 , pp.Statistical analysis of stencil technology for wafer-level bumping
By Kay Robert W.,Cummins Gerard,Krebs Thomas,Lathrop Richard,Abraham Eitan,Desmulliez Marc in (2014)
Soldering & Surface Mount Technology,volume 26,issue 2 , Vol. 26, Iss. 2, 2014-04 , pp.Corrosion of Sn-3.0Ag-0.5Cu thin films on Cu substrates in alkaline solution
By Lee Liu Mei,Nazeri Muhammad Firdaus Mohd,Haliman Habsah,Mohamad Ahmad Azmin in (2014)
Soldering & Surface Mount Technology,volume 26,issue 2 , Vol. 26, Iss. 2, 2014-04 , pp.By Mittal J.,Lin K.L. in (2014)
Soldering & Surface Mount Technology,volume 26,issue 2 , Vol. 26, Iss. 2, 2014-04 , pp.