Period of time: 2015年3期
Publisher: Emerald Group Publishing Ltd
Founded in: 1982
Total resources: 58
E-ISSN: 1758-812X|32|3
ISSN: 1356-5362
Subject: TN Radio Electronics, Telecommunications Technology
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Microelectronics International,volume 32,issue 3
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Magnetoelectric properties in bulk and layered composites
By Guzdek Piotr,Wzorek Marek in (2015)
Microelectronics International,volume 32,issue 3 , Vol. 32, Iss. 3, 2015-08 , pp.Thermoelectric properties of thin-film germanium-based layers
By Markowski Piotr,Prociów Eugeniusz,Urbaniak Łukasz in (2015)
Microelectronics International,volume 32,issue 3 , Vol. 32, Iss. 3, 2015-08 , pp.Impact analysis of LTCC materials on microstrip filters’ behaviour up to 13 GHz
By Pietrikova Alena,Ruman Kornel,Rovensky Tibor,Vehec Igor in (2015)
Microelectronics International,volume 32,issue 3 , Vol. 32, Iss. 3, 2015-08 , pp.Technology and application of the LTCC-based microfluidic module for urea determination
By Malecha Karol,Remiszewska Elżbieta,Pijanowska Dorota G in (2015)
Microelectronics International,volume 32,issue 3 , Vol. 32, Iss. 3, 2015-08 , pp.3D LTCC structure for a large-volume cavity-type chemical microreactor
By Belavič Darko,Hrovat Marko,Makarovič Kostja,Dolanč Gregor,Pohar Andrej,Hočevar Stanko,Malič Barbara in (2015)
Microelectronics International,volume 32,issue 3 , Vol. 32, Iss. 3, 2015-08 , pp.Embossing in fuel cell fabrication
By Dziurdzia Barbara,Magonski Zbigniew,Jankowski Henryk in (2015)
Microelectronics International,volume 32,issue 3 , Vol. 32, Iss. 3, 2015-08 , pp.Material and technological aspects of high-temperature SiC device packages reliability
By Myśliwiec Marcin,Kisiel Ryszard,Guziewicz Marek in (2015)
Microelectronics International,volume 32,issue 3 , Vol. 32, Iss. 3, 2015-08 , pp.Investigation of electrical performance of silicon solar cells with transparent counter electrode
By Drabczyk Kazimierz,Domaradzki Jaroslaw,Panek Piotr,Kaczmarek Danuta in (2015)
Microelectronics International,volume 32,issue 3 , Vol. 32, Iss. 3, 2015-08 , pp.Modelling mutual thermal coupling in LED modules
By Górecki Krzysztof,Ptak Przemysław in (2015)
Microelectronics International,volume 32,issue 3 , Vol. 32, Iss. 3, 2015-08 , pp.Energy losses and DVFS effectiveness vs technology scaling
By Kocanda Piotr,Kos Andrzej in (2015)
Microelectronics International,volume 32,issue 3 , Vol. 32, Iss. 3, 2015-08 , pp.