Period of time: 2014年6期
Publisher: Springer Publishing Company
Founded in: 1990
Total resources: 58
ISSN: 0957-4522
Subject: TB General Industrial Technology
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Journal of Materials Science: Materials in Electronics,volume 22,issue 6
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Recent advances on Sn–Cu solders with alloying elements: review
By Zeng Guang,Xue Songbai,Zhang Liang,Gao Lili in (2011)
Journal of Materials Science: Materials in Electronics,volume 22,issue 6 , Vol. 22, Iss. 6, 2011-06 , pp.Investigation of forming-gas annealed CeO2 thin film on GaN
By Quah Hock,Cheong Kuan,Hassan Zainuriah,Lockman Zainovia in (2011)
Journal of Materials Science: Materials in Electronics,volume 22,issue 6 , Vol. 22, Iss. 6, 2011-06 , pp.The microstructure and properties of the Sn-xBi-0.9Zn-0.3Ag lead-free solders
By Wang X.,Xiu Y.,Dong M.,Liu Y. in (2011)
Journal of Materials Science: Materials in Electronics,volume 22,issue 6 , Vol. 22, Iss. 6, 2011-06 , pp.Electrochemical capacitance study on Co3O4 nanowires for super capacitors application
By Wang Lu,Liu Xiaoheng,Wang Xin,Yang Xujie,Lu Lude in (2011)
Journal of Materials Science: Materials in Electronics,volume 22,issue 6 , Vol. 22, Iss. 6, 2011-06 , pp.Structural, optical and electrical properties of ZnTe1−
By Nagarethinam V.,Ahamed M.,Vijayakumar K.,Amalraj L.,Balu A.,Thayumanavan A.,Murali K.,Sanjeeviraja C.,Jayachandran M. in (2011)
Journal of Materials Science: Materials in Electronics,volume 22,issue 6 , Vol. 22, Iss. 6, 2011-06 , pp.By Crozier B.,Liu Q.,Ivey D. in (2011)
Journal of Materials Science: Materials in Electronics,volume 22,issue 6 , Vol. 22, Iss. 6, 2011-06 , pp.By Sudheendran K.,James Raju K. in (2011)
Journal of Materials Science: Materials in Electronics,volume 22,issue 6 , Vol. 22, Iss. 6, 2011-06 , pp.Electrical conductivity and viscosity of liquid Sn–Sb–Cu alloys
By Plevachuk Yu.,Sklyarchuk V.,Yakymovych A.,Svec P.,Janickovic D.,Illekova E. in (2011)
Journal of Materials Science: Materials in Electronics,volume 22,issue 6 , Vol. 22, Iss. 6, 2011-06 , pp.