THIN-FILM THERMAL CONDUCTIVITY AND THICKNESS MEASUREMENTS USING PICOSECOND ULTRASONICS

Author: Hostetler J. L.   Smith A. N.   Norris P. M.  

Publisher: Taylor & Francis Ltd

ISSN: 1091-7640

Source: Microscale Thermophysical Engineering, Vol.1, Iss.3, 1997-07, pp. : 237-244

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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Abstract