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By Hostetler J. L.   Smith A. N.   Norris P. M.  

Microscale Thermophysical Engineering, Vol. 1, Iss. 3, 1997-07 ,pp. : 237-244

Taylor & Francis Ltd

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An Investigation of the Thermal Stresses Induced in a Thin-Film Thermoelectric Cooler

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Journal of Thermal Stresses, Vol. 31, Iss. 5, 2008-05 ,pp. : 438-454

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Near-Wall Liquid Layering, Velocity Slip, and Solid-Liquid Interfacial Thermal Resistance for Thin-Film Evaporation in Microchannels

By Zhao Jun-Jie   Huang Mei   Min Qi   Christopher David   Duan Yuan-Yuan  

Nanoscale and Microscale Thermophysical Engineering, Vol. 15, Iss. 2, 2011-04 ,pp. : 105-122

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INFLUENCE OF INTERFACE THERMAL CONDUCTANCE ON THE APPARENT THERMAL CONDUCTIVITY OF THIN FILMS

By Lee S.-M.   Cahill David G.  

Microscale Thermophysical Engineering, Vol. 1, Iss. 1, 1997-01 ,pp. : 47-52

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MOLECULAR DYNAMICS SIMULATION OF THERMAL CONDUCTIVITY OF NANOSCALE THIN SILICON FILMS

By Feng Xiao-Li  

Microscale Thermophysical Engineering, Vol. 7, Iss. 2, 2003-04 ,pp. : 153-161

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