Author: Mukherjee Moumita Mazumder Nilratan Roy Sitesh Kumar
Publisher: Taylor & Francis Ltd
ISSN: 1362-3060
Source: International Journal of Electronics, Vol.98, Iss.4, 2011-04, pp. : 449-458
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Thermosonic flip-chip bonding for SAW filter
By Tomioka T. Iguchi T. Mori I.
Microelectronics Reliability, Vol. 44, Iss. 1, 2004-01 ,pp. :
By Acharyya Aritra Mallik Aliva Banerjee Debopriya Ganguli Suman Das Arindam Dasgupta Sudeepto Banerjee J. P.
Journal of Semiconductors, Vol. 35, Iss. 8, 2014-08 ,pp. :